Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128116 | Integrated direct dielectric and metal deposition | William T. Lee, Bart J. van Schravendijk, David Charles Smith, Michal Danek, Ramesh Chandrasekharan | 2018-11-13 |
| 10049921 | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor | Nerissa Draeger, Kaihan Ashtiani, Deenesh Padhi, Derek Wong, Bart J. van Schravendijk +3 more | 2018-08-14 |
| 9916977 | Low k dielectric deposition via UV driven photopolymerization | Nicholas Muga Ndiege, Jonathan D. Mohn | 2018-03-13 |
| 9875968 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more | 2018-01-23 |