Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103056 | Methods for wet metal seed deposition for bottom up gapfill of features | Samantha Tan, Boris Volosskiy, Taeseung Kim, Novy Tjokro, Artur Kolics | 2018-10-16 |
| 9875968 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Kaihan Ashtiani +2 more | 2018-01-23 |