Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163830 | Bonding pads with thermal pathways | James M. Derderian, Sameer S. Vadhavkar, Jian Li | 2018-12-25 |
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, James M. Derderian +1 more | 2018-12-25 |
| 10134647 | Methods for forming interconnect assemblies with probed bond pads | Owen R. Fay, Kyle K. Kirby, Luke England | 2018-11-20 |
| 10126357 | Methods of testing semiconductor devices comprising a die stack having protruding conductive elements | Michel Koopmans, James M. Derderian | 2018-11-13 |
| 10096502 | Method and apparatus for assembling and testing a multi-integrated circuit package | Gamal Refai-Ahmed, Suresh Ramalingam, Mohsen H. Mardi, Tien-Yu Lee, Ivor G. Barber +1 more | 2018-10-09 |
| 10096579 | Thermal pads between stacked semiconductor dies and associated systems and methods | Michel Koopmans | 2018-10-09 |
| 9966347 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Christopher J. Gambee, Satish Yeldandi | 2018-05-08 |
| 9960150 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Xiao Li | 2018-05-01 |
| 9941190 | Semiconductor device having through-silicon-via and methods of forming the same | Wayne H. Huang | 2018-04-10 |
| 9905539 | Interconnect structures with intermetallic palladium joints and associated systems and methods | — | 2018-02-27 |
| 9881858 | Solder bond site including an opening with discontinuous profile | Dale Arnold | 2018-01-30 |
| 9881886 | Semiconductor device assemblies including intermetallic compound interconnect structures | — | 2018-01-30 |