Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074633 | Semiconductor die assemblies having molded underfill structures and related technology | Xiao Li | 2018-09-11 |
| 9960150 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2018-05-01 |