Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163693 | Methods for processing semiconductor dice and fabricating assemblies incorporating same | Andrew M. Bayless, James M. Derderian | 2018-12-25 |
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2018-12-25 |
| 10074633 | Semiconductor die assemblies having molded underfill structures and related technology | Bradley R. Bitz | 2018-09-11 |
| 9960150 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Jaspreet S. Gandhi | 2018-05-01 |