Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2018-12-25 |
| 10163830 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2018-12-25 |
| 10079333 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2018-09-18 |