Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2018-12-25 |
| 10134655 | Semiconductor device packages with direct electrical connections and related methods | Jian Li, Shijian Luo | 2018-11-20 |
| 9899293 | Semiconductor device packages with improved thermal management and related methods | Jian Li, Shijian Luo | 2018-02-20 |