Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163693 | Methods for processing semiconductor dice and fabricating assemblies incorporating same | Andrew M. Bayless, Xiao Li | 2018-12-25 |
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2018-12-25 |
| 10163830 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2018-12-25 |
| 10126357 | Methods of testing semiconductor devices comprising a die stack having protruding conductive elements | Jaspreet S. Gandhi, Michel Koopmans | 2018-11-13 |
| 10043688 | Method for mount tape die release system for thin die ejection | Jeremy E. Minnich, Brandon P. Wirz, Bret K. Street | 2018-08-07 |