Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043688 | Method for mount tape die release system for thin die ejection | Jeremy E. Minnich, Bret K. Street, James M. Derderian | 2018-08-07 |
| 9966347 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Jaspreet S. Gandhi, Christopher J. Gambee, Satish Yeldandi | 2018-05-08 |