Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090177 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Benjamin L. McClain, Travis M. Jensen | 2018-10-02 |
| 10043688 | Method for mount tape die release system for thin die ejection | Brandon P. Wirz, Bret K. Street, James M. Derderian | 2018-08-07 |