Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157830 | 3D interconnect multi-die inductors with through-substrate via cores | — | 2018-12-18 |
| 10134647 | Methods for forming interconnect assemblies with probed bond pads | Owen R. Fay, Luke England, Jaspreet S. Gandhi | 2018-11-20 |
| 10134671 | 3D interconnect multi-die inductors with through-substrate via cores | — | 2018-11-20 |
| 10121739 | Multi-die inductors with coupled through-substrate via cores | — | 2018-11-06 |
| 10020287 | Pass-through interconnect structure for microelectronic dies and associated systems and methods | David S. Pratt, Dewali Ray | 2018-07-10 |
| 9966406 | Semiconductor devices including back-side integrated circuitry | Steve Oliver | 2018-05-08 |
| 9935085 | Semiconductor substrates with unitary vias and via terminals, and associated systems and methods | Kunal R. Parekh | 2018-04-03 |
| 9917002 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2018-03-13 |