Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147664 | Dynamic mounting thermal management for devices on board | Gamal Refai-Ahmed, Daniel Elftmann, Brian D. Philofsky, Anthony Torza | 2018-12-04 |
| 10096502 | Method and apparatus for assembling and testing a multi-integrated circuit package | Gamal Refai-Ahmed, Mohsen H. Mardi, Tien-Yu Lee, Ivor G. Barber, Cheang-Whang Chang +1 more | 2018-10-09 |
| 10043730 | Stacked silicon package assembly having an enhanced lid | Gamal Refai-Ahmed, Tien-Yu Lee, Ferdinand F. Fernandez, Ivor G. Barber, Inderjit Singh +1 more | 2018-08-07 |
| 10038259 | Low insertion loss package pin structure and method | Paul Ying-Fung Wu, Sarajuddin Niazi, Raymond E. Anderson | 2018-07-31 |