TL

Tien-Yu Lee

AM AMD: 2 patents #75 of 731Top 15%
📍 Taipei, CA: #51 of 168 inventorsTop 35%
Overall (2018): #95,468 of 503,207Top 20%
2
Patents 2018

Issued Patents 2018

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10096502 Method and apparatus for assembling and testing a multi-integrated circuit package Gamal Refai-Ahmed, Suresh Ramalingam, Mohsen H. Mardi, Ivor G. Barber, Cheang-Whang Chang +1 more 2018-10-09
10043730 Stacked silicon package assembly having an enhanced lid Gamal Refai-Ahmed, Ferdinand F. Fernandez, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh +1 more 2018-08-07