Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10144634 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee +2 more | 2018-12-04 |
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2018-08-14 |
| 10032705 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi +5 more | 2018-07-24 |
| 9978695 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2018-05-22 |
| 9966652 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2018-05-08 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Won Bae Bang, Gi Jeong Kim, Ji Young Chung | 2018-03-20 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2018-03-06 |
| 9881864 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2018-01-30 |
| 9871011 | Semiconductor package using a contact in a pleated sidewall encapsulant opening | Jae Yun Kim, Tae Kyung Hwang, Jin Han Kim, Jong Sik Paek, Kyoung Rock Kim +1 more | 2018-01-16 |