Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2018-10-02 |
| 10062626 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2018-08-28 |
| 9984947 | Fingerprint sensor and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2018-05-29 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim | 2018-03-20 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim | 2018-03-06 |