Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2018-08-14 |
| 9978695 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Byong Jin Kim | 2018-05-22 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Byong Jin Kim, Gi Jeong Kim, Ji Young Chung | 2018-03-20 |
| 9881864 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2018-01-30 |