Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Jae Doo Kwon, Hyung Il Jeon | 2018-08-14 |
| 9966652 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2018-05-08 |
| 9929075 | Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity | Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang | 2018-03-27 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2018-03-20 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Ji Young Chung | 2018-03-06 |