Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032699 | Flip chip self-alignment features for substrate and leadframe applications | — | 2018-07-24 |
| 10032726 | Embedded vibration management system | Bora Baloglu, Adrian Arcedera, Russell Shumway | 2018-07-24 |
| 9966652 | Packaged electronic device having integrated antenna and locking structure | Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2018-05-08 |
| 9917039 | Method of forming a semiconductor package with conductive interconnect frame and structure | Thinh Pham | 2018-03-13 |
| 9870985 | Semiconductor package with clip alignment notch | — | 2018-01-16 |