Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134635 | Stress relieving through-silicon vias | Ronald Patrick Huemoeller | 2018-11-20 |
| 10062611 | Encapsulated semiconductor package and method of manufacturing thereof | Curtis Zwenger, Ron Huemoeller | 2018-08-28 |
| 10032726 | Embedded vibration management system | Adrian Arcedera, Marc Alan Mangrum, Russell Shumway | 2018-07-24 |
| 9905440 | Method of manufacturing an electronic device and electronic device manufactured thereby | Curtis Zwenger, Ronald Patrick Huemoeller | 2018-02-27 |