Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9917039 | Method of forming a semiconductor package with conductive interconnect frame and structure | Marc Alan Mangrum | 2018-03-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9917039 | Method of forming a semiconductor package with conductive interconnect frame and structure | Marc Alan Mangrum | 2018-03-13 |