Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon | 2018-08-14 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Gi Jeong Kim, Ji Young Chung | 2018-03-06 |