JK

Jae Doo Kwon

AT Amkor Technology: 1 patents #52 of 150Top 35%
Overall (2018): #383,159 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
10049954 Semiconductor package having routable encapsulated conductive substrate and method Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon 2018-08-14