Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020263 | Semiconductor package and manufacturing method thereof | Tae Yong Lee, Min-Chul Shin, Se Man Oh | 2018-07-10 |
| 9911685 | Land structure for semiconductor package and method therefor | Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2018-03-06 |