Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929075 | Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity | Eun Sook Sohn, Won Joon Kang, Gi Jeong Kim | 2018-03-27 |
| 9871011 | Semiconductor package using a contact in a pleated sidewall encapsulant opening | Jae Yun Kim, Jin Han Kim, Jong Sik Paek, Kyoung Rock Kim, Byong Jin Kim +1 more | 2018-01-16 |