Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho +4 more | 2018-10-02 |
| 9871011 | Semiconductor package using a contact in a pleated sidewall encapsulant opening | Tae Kyung Hwang, Jin Han Kim, Jong Sik Paek, Kyoung Rock Kim, Byong Jin Kim +1 more | 2018-01-16 |
| 9862820 | Additive composition for polymer-modified asphalt, polymer-modified asphalt composition comprising the same, and method for preparing the same | Tae Hee Kim, Yeong Min Jung | 2018-01-09 |
| 9859203 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park | 2018-01-02 |