Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037949 | Semiconductor package and fabricating method thereof | Hee Sung Kim, Yeoung Beom Ko, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim | 2018-07-31 |
| 9859203 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park | 2018-01-02 |