Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9916989 | System and method for laser assisted bonding of semiconductor die | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim | 2018-03-13 |
| 9859203 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park | 2018-01-02 |