BA

Byoung Jun Ahn

AT Amkor Technology: 1 patents #52 of 150Top 35%
Overall (2018): #468,156 of 503,207Top 95%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9859203 Semiconductor package and fabricating method thereof Keun Soo Kim, Jae Yun Kim, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park 2018-01-02