Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037949 | Semiconductor package and fabricating method thereof | Hee Sung Kim, Dae Byoung Kang, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim | 2018-07-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037949 | Semiconductor package and fabricating method thereof | Hee Sung Kim, Dae Byoung Kang, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim | 2018-07-31 |