Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2018-10-02 |
| 9917063 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Cha Gyu Song | 2018-03-13 |