Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Dong Joo Park, Byong Woo Cho +4 more | 2018-10-02 |
| 10062626 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ji Young Chung, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2018-08-28 |