Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Byong Woo Cho +4 more | 2018-10-02 |
| 9984947 | Fingerprint sensor and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2018-05-29 |