Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163867 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2018-12-25 |
| 10144634 | Semiconductor package and manufacturing method thereof | Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee +2 more | 2018-12-04 |
| 10032705 | Semiconductor package and manufacturing method thereof | Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2018-07-24 |
| 9935083 | Semiconductor package and manufacturing method thereof | Yung Woo Lee, Mi Kyeong Choi, Jin Seong Kim | 2018-04-03 |