Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163867 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more | 2018-12-25 |
| 9875980 | Copper pillar sidewall protection | Glenn Rinne, Dean Zehnder, Christopher J. Berry, Ludovico E. Bancod | 2018-01-23 |