Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842767 | Method of forming an interconnection | Tz-Jun Kuo, Chien-Hsin Ho, Hsiang-Huan Lee | 2017-12-12 |
| 9818644 | Interconnect structure and manufacturing method thereof | Shin-Yi Yang, Hsi-Wen Tien, Hsiang-Huan Lee, Shau-Lin Shue | 2017-11-14 |
| 9728485 | Semiconductor device with interconnect structure having catalys layer | Shau-Lin Shue | 2017-08-08 |
| 9728503 | Via pre-fill on back-end-of-the-line interconnect layer | Chao-Hsien Peng, Chi-Liang Kuo, Hsiang-Huan Lee, Shau-Lin Shue | 2017-08-08 |
| 9721894 | Semiconductor device and manufacturing method thereof | Shih-Kang Fu, Hsien-Chang Wu, Li-Lin Su, Shau-Lin Shue | 2017-08-01 |
| 9721887 | Method of forming metal interconnection | Chao-Hsien Peng, Chih Wei Lu, Shau-Lin Shue | 2017-08-01 |
| 9640431 | Method for via plating with seed layer | Shin-Yi Yang, Ching-Fu Yeh, Tz-Jun Kuo, Hsiang-Huan Lee | 2017-05-02 |
| 9613856 | Method of forming metal interconnection | Shin-Yi Yang, Shau-Lin Shue, Tz-Jun Kuo | 2017-04-04 |
| 9613854 | Method and apparatus for back end of line semiconductor device processing | Shin-Yi Yang, Hsiang-Huan Lee, Ching-Fu Yeh, Pei-Yin Liou | 2017-04-04 |
| 9548241 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more | 2017-01-17 |