Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842767 | Method of forming an interconnection | Ming-Han Lee, Chien-Hsin Ho, Hsiang-Huan Lee | 2017-12-12 |
| 9640431 | Method for via plating with seed layer | Shin-Yi Yang, Ching-Fu Yeh, Hsiang-Huan Lee, Ming-Han Lee | 2017-05-02 |
| 9613856 | Method of forming metal interconnection | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2017-04-04 |