Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640431 | Method for via plating with seed layer | Shin-Yi Yang, Tz-Jun Kuo, Hsiang-Huan Lee, Ming-Han Lee | 2017-05-02 |
| 9613854 | Method and apparatus for back end of line semiconductor device processing | Shin-Yi Yang, Hsiang-Huan Lee, Ming-Han Lee, Pei-Yin Liou | 2017-04-04 |
| 9607891 | Aluminum interconnection apparatus | Hsiang-Huan Lee | 2017-03-28 |
| 9570347 | Method of semiconductor integrated circuit fabrication | Chao-Hsien Peng, Hsien-Chang Wu, Hsiang-Huan Lee | 2017-02-14 |