Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837310 | Method of manufacturing a semiconductor device | Chi-Liang Kuo, Hsiang-Huan Lee, Shau-Lin Shue | 2017-12-05 |
| 9728503 | Via pre-fill on back-end-of-the-line interconnect layer | Chi-Liang Kuo, Ming-Han Lee, Hsiang-Huan Lee, Shau-Lin Shue | 2017-08-08 |
| 9721887 | Method of forming metal interconnection | Chih Wei Lu, Ming-Han Lee, Shau-Lin Shue | 2017-08-01 |
| 9646932 | Method for forming interconnect structure that avoids via recess | Tsung-Min Huang, Hsiang-Huan Lee, Shau-Lin Shue | 2017-05-09 |
| 9570347 | Method of semiconductor integrated circuit fabrication | Ching-Fu Yeh, Hsien-Chang Wu, Hsiang-Huan Lee | 2017-02-14 |