Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837310 | Method of manufacturing a semiconductor device | Chao-Hsien Peng, Hsiang-Huan Lee, Shau-Lin Shue | 2017-12-05 |
| 9728503 | Via pre-fill on back-end-of-the-line interconnect layer | Chao-Hsien Peng, Ming-Han Lee, Hsiang-Huan Lee, Shau-Lin Shue | 2017-08-08 |