HT

Hsi-Wen Tien

TSMC: 3 patents #685 of 2,832Top 25%
📍 Xinfeng, TW: #1 of 3 inventorsTop 35%
Overall (2017): #76,467 of 506,227Top 20%
3
Patents 2017

Issued Patents 2017

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9818644 Interconnect structure and manufacturing method thereof Shin-Yi Yang, Ming-Han Lee, Hsiang-Huan Lee, Shau-Lin Shue 2017-11-14
9799558 Method for forming conductive structure in semiconductor structure Carlos H. Diaz, Chung-Ju Lee, Shau-Lin Shue, Tien-I Bao 2017-10-24
9589890 Method for interconnect scheme Hsin-Chieh Yao, Carlos H. Diaz, Cheng-Hsiung Tsai, Chung-Ju Lee, Chien-Hua Huang +3 more 2017-03-07