Issued Patents 2017
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847324 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Kang Chen | 2017-12-19 |
| 9842798 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Pandi C. Marimuthu, Kang Chen, Yu Gu, Won Kyoung Choi | 2017-12-12 |
| 9837303 | Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units | Kang Chen, Yu Gu, Pandi C. Marimuthu | 2017-12-05 |
| 9818734 | Semiconductor device and method of forming build-up interconnect structures over a temporary substrate | Kang Chen | 2017-11-14 |
| 9806040 | Antenna in embedded wafer-level ball-grid array package | Kai Liu | 2017-10-31 |
| 9786623 | Semiconductor device and method of forming PoP semiconductor device with RDL over top package | — | 2017-10-10 |
| 9768155 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Kang Chen, Seung Wook Yoon | 2017-09-19 |
| 9768038 | Semiconductor device and method of making embedded wafer level chip scale packages | — | 2017-09-19 |
| 9754867 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Kang Chen, Jianmin Fang, Xia Feng | 2017-09-05 |
| 9754897 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2017-09-05 |
| 9754858 | Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die | Reza A. Pagaila, Seung Uk Yoon | 2017-09-05 |
| 9721922 | Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package | Pandi C. Marimuthu, Won Kyoung Choi, Il Kwon Shim | 2017-08-01 |
| 9721862 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Pandi C. Marimuthu | 2017-08-01 |
| 9701534 | Semiconductor device and method of forming MEMS package | Il Kwon Shim | 2017-07-11 |
| 9704769 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Thomas Strothmann, Seung Wook Yoon | 2017-07-11 |
| 9704780 | Semiconductor device and method of forming low profile fan-out package with vertical interconnection units | Pandi C. Marimuthu, Il Kwon Shim, Won Kyoung Choi | 2017-07-11 |
| 9704824 | Semiconductor device and method of forming embedded wafer level chip scale packages | Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han | 2017-07-11 |
| 9685495 | Semiconductor device and method of forming IPD on molded substrate | — | 2017-06-20 |
| 9685415 | Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect | Kang Chen | 2017-06-20 |
| 9685350 | Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB | Xu Sheng Bao, Kang Chen | 2017-06-20 |
| 9679863 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Jianmin Fang, Xia Feng, Kang Chen | 2017-06-13 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more | 2017-05-30 |
| 9653445 | Semiconductor device and method of fabricating 3D package with short cycle time and high yield | — | 2017-05-16 |
| 9620455 | Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure | Reza A. Pagaila, Jun Mo Koo | 2017-04-11 |
| 9620413 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2017-04-11 |