| 9754867 |
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package |
Yaojian Lin, Kang Chen, Jianmin Fang |
2017-09-05 |
| 9679863 |
Semiconductor device and method of forming interconnect substrate for FO-WLCSP |
Yaojian Lin, Jianmin Fang, Kang Chen |
2017-06-13 |
| 9666500 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more |
2017-05-30 |
| 9626922 |
GOA circuit, array substrate, display device and driving method |
Jiacheng Huang, Jian He |
2017-04-18 |
| 9558958 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation |
Yaojian Lin, Kang Chen, Jianmin Fang |
2017-01-31 |
| 9548240 |
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package |
Yaojian Lin, Kang Chen, Jianmin Fang |
2017-01-17 |
| 9542898 |
Driving method of a liquid crystal display panel, a liquid crystal display panel and a display device |
Jiacheng Huang, Donghui Wang |
2017-01-10 |