Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu, Il Kwon Shim +4 more | 2017-05-30 |
| 9607965 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin | 2017-03-28 |