KC

Kang Chen

SC Stats Chippac: 15 patents #2 of 128Top 2%
Overall (2017): #2,999 of 506,227Top 1%
15
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9847324 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin 2017-12-19
9842798 Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Pandi C. Marimuthu, Yaojian Lin, Yu Gu, Won Kyoung Choi 2017-12-12
9837303 Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units Yaojian Lin, Yu Gu, Pandi C. Marimuthu 2017-12-05
9818734 Semiconductor device and method of forming build-up interconnect structures over a temporary substrate Yaojian Lin 2017-11-14
9768155 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin, Seung Wook Yoon 2017-09-19
9754867 Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package Yaojian Lin, Jianmin Fang, Xia Feng 2017-09-05
9685350 Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB Yaojian Lin, Xu Sheng Bao 2017-06-20
9685415 Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect Yaojian Lin 2017-06-20
9679863 Semiconductor device and method of forming interconnect substrate for FO-WLCSP Yaojian Lin, Jianmin Fang, Xia Feng 2017-06-13
9666500 Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Yaojian Lin, Pandi C. Marimuthu, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more 2017-05-30
9607965 Semiconductor device and method of controlling warpage in reconstituted wafer Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Seng Guan Chow, Yaojian Lin 2017-03-28
9607958 Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation Yaojian Lin, Pandi C. Marimuthu 2017-03-28
9601434 Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure Yaojian Lin, Jianmin Fang 2017-03-21
9558958 Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation Yaojian Lin, Jianmin Fang, Xia Feng 2017-01-31
9548240 Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package Yaojian Lin, Jianmin Fang, Xia Feng 2017-01-17