Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685350 | Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB | Yaojian Lin, Kang Chen | 2017-06-20 |
| 9620557 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Lee Sun Lim, Rui Huang, Ma Phoo Pwint Hlaing | 2017-04-11 |