Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9620557 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Lee Sun Lim, Xu Sheng Bao, Ma Phoo Pwint Hlaing | 2017-04-11 |
| 9564387 | Semiconductor package having routing traces therein | Saravuth Sirinorakul, Antonio B. Dimaano, Jr. | 2017-02-07 |