| 9842798 |
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units |
Yaojian Lin, Kang Chen, Yu Gu, Won Kyoung Choi |
2017-12-12 |
| 9842775 |
Semiconductor device and method of forming a thin wafer without a carrier |
Shuangwu Huang, Nathapong Suthiwongsunthorn |
2017-12-12 |
| 9837303 |
Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units |
Yaojian Lin, Kang Chen, Yu Gu |
2017-12-05 |
| 9754897 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits |
Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Won Kyoung Choi +1 more |
2017-09-05 |
| 9721862 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages |
Byung Joon Han, Il Kwon Shim, Yaojian Lin |
2017-08-01 |
| 9721921 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more |
2017-08-01 |
| 9721922 |
Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package |
Yaojian Lin, Won Kyoung Choi, Il Kwon Shim |
2017-08-01 |
| 9704780 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units |
Il Kwon Shim, Yaojian Lin, Won Kyoung Choi |
2017-07-11 |
| 9704824 |
Semiconductor device and method of forming embedded wafer level chip scale packages |
Yaojian Lin, Il Kwon Shim, Byung Joon Han |
2017-07-11 |
| 9666500 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
Yaojian Lin, Kang Chen, Hin Hwa Goh, Yu Gu, Il Kwon Shim +4 more |
2017-05-30 |
| 9620413 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging |
Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more |
2017-04-11 |
| 9607958 |
Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation |
Yaojian Lin, Kang Chen |
2017-03-28 |
| 9559039 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package |
Il Kwon Shim, Jun Mo Koo, Yaojian Lin, See Chian Lim |
2017-01-31 |