Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679824 | Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP | Reza A. Pagaila, Rajendra D. Pendse | 2017-06-13 |
| 9620455 | Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure | Reza A. Pagaila, Yaojian Lin | 2017-04-11 |
| 9559039 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim | 2017-01-31 |