Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2017-04-18 |
| 9559039 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Pandi C. Marimuthu, Yaojian Lin | 2017-01-31 |