Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824923 | Semiconductor device and method of forming conductive pillar having an expanded base | Dzafir Bin Mohd Shariff, Kwong Loon Yam, Lai Yee Chia | 2017-11-21 |
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2017-04-18 |